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LSM6DSV16BX Datasheet(PDF) 1 Page - STMicroelectronics |
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LSM6DSV16BX Datasheet(HTML) 1 Page - STMicroelectronics |
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1 / 148 page  Features • Triple core for UI, bone conduction, and Qvar sensing • Power consumption: 0.95 mA in combo high-performance mode • “Always-on" experience with low power consumption for both accelerometer and gyroscope • Smart FIFO up to 4.5 KB • ±2/±4/±8/±16 g full scale • ±125/±250/±500/±1000/±2000/±4000 dps full scale • Analog supply voltage: 1.71 V to 3.6 V • Independent IO supply (extended range: 1.08 V to 3.6 V) • Compact footprint: 2.5 mm x 3 mm x 0.71 mm • SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data synchronization • TDM slave interface • Advanced pedometer, step detector, and step counter • Significant motion detection, tilt detection • Standard interrupts: free-fall, wakeup, 6D orientation, click and double-click • Programmable finite state machine for accelerometer, gyroscope, and Qvar sensor data processing with high rate @ 960 Hz • Machine learning core with exportable features and filters for AI applications • Embedded Qvar: electric charge variation detection • Embedded analog hub for ADC and processing analog input data • Embedded sensor fusion low-power algorithm • Embedded temperature sensor • ECOPACK and RoHS compliant Applications • Motion tracking and gesture detection • Wearables • TWS (true wireless stereo) • IoT and connected devices • Handheld devices • Vibration detection for bone conduction Description The LSM6DSV16BX is a system-in-package featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope with a triple core for processing acceleration, angular rate, and Qvar sensing data on three separate channels with dedicated configuration, processing, and filtering. The LSM6DSV16BX integrates a UI sensor, audio accelerometer, and Qvar sensor in a compact package (2.5 x 3.0 x 0.71 mm). The UI in high-performance mode runs at 0.6 mA and enables always-on low-power features for an optimal motion experience for wearable and TWS applications. Product status link LSM6DSV16BX Product summary Order code LSM6DSV16BX LSM6DSV16BXTR Temperature range [°C] -40 to +85 Package LGA-14L (2.5 x 3.0 x 0.71 mm) Packing Tray Tape and reel Product resources TN0018 (Design and soldering) Product label iNEMO 3-axis accelerometer and 3-axis gyroscope: inertial module for UI and bone conduction with embedded machine learning core and Qvar specification LSM6DSV16BX Datasheet DS13771 - Rev 2 - July 2022 For further information contact your local STMicroelectronics sales office. www.st.com |
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