DSP56004SLASHD datasheet(73/82 Pages) FREESCALE

73 / 82 page

Packaging

Pin-out and Package Information

MOTOROLA

DSP56004/D, Rev. 3

3-7

Figure 3-3 80-pin Plastic Quad Flat Pack (PQFP) Mechanical Information

MIN

MAX

MILLIMETERS

DIM

13.90

2.15

0.22

2.00

0.22

0.13

0.65

0.13

16.95

0.13

16.95

0.35

14.10

2.45

0.38

2.40

0.33

0.25

0.23

0.95

105

0.17

0.30

17.45

0.45

0.65 BSC

12.35 BSC

0.325 BSC

1.6 REF

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEAD WHERE

THE LEAD EXITS THE PLASTIC BODY AT THE

BOTTOM OF THE PARTING LINE.

4. DATUMS -A-, -B- AND -D- TO BE DETERMINED AT

DATUM PLANE -H-.

5. DIMENSIONS S AND V TO BE DETERMINED AT

SEATING PLANE -C-.

6. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS 0.25

PER SIDE. DIMENSIONS A AND B DO

INCLUDE MOLD MISMATCH AND ARE DETERMINED

AT DATUM PLANE -H-.

7. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR PROTRUSION

SHALL BE 0.08 TOTAL IN EXCESS OF THE D

DIMENSION AT MAXIMUM MATERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT.

-A,B,D-

DETAIL A

SECTION B-B

0.20

A-B

-H-

DATUM

PLANE

DETAIL C

0.01

-H- DATUM

PLANE

DETAIL C

SEATING

PLANE

-C-

120

-D-

-B-

-A-

DETAIL A

0.20

A-B

0.20

A-B

0.05

CASE 841B-01

ISSUE O

Freescale Semiconductor, Inc.

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DSP56004/D Datasheet(PDF) 73 Page - Freescale Semiconductor, Inc

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