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DSP56004/D Datasheet(PDF) 9 Page - Freescale Semiconductor, Inc |
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DSP56004/D Datasheet(HTML) 9 Page - Freescale Semiconductor, Inc |
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9 / 82 page ![]() Signal/Connection Descriptions Power MOTOROLA DSP56004/D, Rev. 3 1-3 POWER GROUND Table 1-2 Power Inputs Power Name Description VCCP PLL Power —VCCP provides isolated power for the Phase Lock Loop (PLL). The voltage should be well-regulated and the input should be provided with an extremely low impedance path to the VCC power rail. VCCQ Quiet Power —VCCQ provides isolated power for the internal processing logic. This input must be tied externally to all other chip power inputs. The user must provide adequate external decoupling capacitors. VCCA Address Bus Power —VCCA provides isolated power for sections of the address bus I/O drivers. This input must be tied externally to all other chip power inputs. The user must provide adequate external decoupling capacitors. VCCD Data Bus Power —VCCD provides isolated power for sections of the data bus I/O drivers. This input must be tied externally to all other chip power inputs. The user must provide adequate external decoupling capacitors. VCCS Serial Interface Power —VCCS provides isolated power for the SHI and SAI. This input must be tied externally to all other chip power inputs. The user must provide adequate external decoupling capacitors. Table 1-3 Grounds Ground Name Description GNDP PLL Ground —GNDP is ground dedicated for PLL use. The connection should be provided with an extremely low-impedance path to ground. VCCP should be bypassed to GNDP by a 0.47 µF capacitor located as close as possible to the chip package. GNDQ Quiet Ground —GNDQ provides isolated ground for the internal processing logic. This connection must be tied externally to all other chip ground connections. The user must provide adequate external decoupling capacitors. GNDA Address Bus Ground —GNDA provides isolated ground for sections of the address bus I/O drivers. This connection must be tied externally to all other chip ground connections. The user must provide adequate external decoupling capacitors. GNDD Data Bus Ground —GNDD provides isolated ground for sections of the data bus I/O drivers. This connection must be tied externally to all other chip ground connections. The user must provide adequate external decoupling capacitors. GNDS Serial Interface Ground —GNDS provides isolated ground for the SHI and SAI. This connection must be tied externally to all other chip ground connections. The user must provide adequate external decoupling capacitors. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
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