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AMD-K6-2E/233AMZ Datasheet(PDF) 8 Page - Advanced Micro Devices

Part # AMD-K6-2E/233AMZ
Description  AMD-K6??2E Embedded Processor
PDF  332 Pages
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Manufacturer  AMD [Advanced Micro Devices]
Direct Link  http://www.amd.com
Logo AMD - Advanced Micro Devices

AMD-K6-2E/233AMZ Datasheet(HTML) 8 Page - Advanced Micro Devices

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Contents
AMD-K6™-2E Processor Data Sheet
22529B/0—January 2000
Preliminary Information
14.2
Absolute Ratings..................................................................... 255
14.3
DC Characteristics .................................................................. 256
14.4
Power Dissipation ................................................................... 258
14.5
Power Derating Based on Lower CPU Frequencies ............ 260
14.6
Power and Grounding............................................................. 262
14.7
I/O Buffer Characteristics ...................................................... 264
15
Signal Switching Characteristics ............................................ 267
15.1
CLK Switching Characteristics.............................................. 267
15.2
Clock Switching Characteristics
for 100-MHz Bus Operation.................................................... 268
15.3
Clock Switching Characteristics
for 66-MHz Bus Operation...................................................... 268
15.4
Valid Delay, Float, Setup, and Hold Timings ...................... 269
15.5
Output Delay Timings for 100-MHz Bus Operation............. 270
15.6
Input Setup and Hold Timings
for 100-MHz Bus Operation.................................................... 272
15.7
Output Delay Timings for 66-MHz Bus Operation............... 274
15.8
Input Setup and Hold Timings
for 66-MHz Bus Operation...................................................... 276
15.9
RESET and Test Signal Timing ............................................. 278
15.10 Timing Diagrams..................................................................... 281
16
Thermal Design ........................................................................ 285
16.1
Package Thermal Specifications ........................................... 285
16.2
Measuring Case Temperature ............................................... 288
16.3
Sample Heatsink Measured Data.......................................... 289
16.4
Layout and Airflow Considerations ...................................... 295
17
Pin Designation Diagrams ....................................................... 299
17.1
Pin Designations by Functional Grouping ........................... 301
18
Package Specifications ............................................................ 303
18.1
321-Pin Staggered CPGA Package Specification................. 303
19
Ordering Information .............................................................. 305
Index........................................................................................... 307



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