4

INA203-Q1

SBOS539A – DECEMBER 2010 – REVISED APRIL 2016

www.ti.com

Product Folder Links: INA203-Q1

Submit Documentation Feedback

Copyright © 2010–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

VS

18

V

Current-shunt monitor analog

inputs, VIN+ and VIN–

Differential (VIN+) – (VIN–)

–18

18

V

Common-mode

–16

80

V

Comparator analog input

CMP1 IN+, CMP1 IN-/0.6-V REF,

CMP2 IN+, CMP2 IN-/0.6-V REF

GND – 0.3

(VS) + 0.3

V

Comparator reset

CMP1 RESET

GND – 0.3

(VS) + 0.3

Analog output

OUT

GND – 0.3

(VS) + 0.3

V

Comparator output

CMP1 OUT, CMP2 OUT

GND – 0.3

(VS) + 0.3

V

1.2-V REF and CMP2 DELAY pins

GND – 0.3

(VS) up to 10

V

Input current into any pin

5

mA

Operating temperature

–55

150

°C

Junction temperature

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1)

±2000

V

Charged-device model (CDM), per AEC Q100-011

±500

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCM

Common-mode input voltage

–16

12

80

V

VS

Operating supply voltage

2.7

12

18

V

TA

Operating free-air temperature

–40

25

125

ºC

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.4 Thermal Information

THERMAL METRIC(1)

INA203-Q1

UNIT

PW (TSSOP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

112.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

37.2

°C/W

RθJB

Junction-to-board thermal resistance

55.4

°C/W

ψJT

Junction-to-top characterization parameter

2.7

°C/W

ψJB

Junction-to-board characterization parameter

54.7

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

150

°C/W