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STA339BW Datasheet(PDF) 74 Page - STMicroelectronics |
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STA339BW Datasheet(HTML) 74 Page - STMicroelectronics |
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74 / 78 page ![]() Package thermal characteristics STA339BW 74/78 DocID15251 Rev 8 9 Package thermal characteristics Using a double-layer PCB the thermal resistance junction to ambient with 2 copper ground areas of 3 x 3 cm2 and with 16 via holes (see Figure 25) is 24 °C/W in natural air convection. The dissipated power within the device depends primarily on the supply voltage, load impedance and output modulation level. Thus, the maximum estimated dissipated power for the STA339BW is: Figure 25. Double-layer PCB with 2 copper ground areas and 16 via holes Figure 26 shows the power derating curve for the PowerSSO-36 slug-down package on PCBs with copper areas of 2 x 2 cm2 and 3 x 3 cm2. Figure 26. PowerSSO-36 power derating curve 2 x 20 W @ 8 , 18 V Pd max ~ 4 W 2 x 10 W + 1 x 20 W @ 4 , 8 ,18 V Pd max < 5 W STA339BW PowerSSO-36 |
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