SPC563M60X datasheet(70/128 Pages) STMICROELECTRONICS

70 / 128 page

Electrical characteristics

SPC563M64x, SPC563M60x

70/128

DocID14642 Rev 12

4.3

Thermal characteristics

Internal structures hold the voltage greater than –1.0 V if the injection current limit of 2 mA is met.

Internal structures hold the input voltage less than the maximum voltage on all pads powered by VDDEH supplies, if the

maximum injection current specification is met (2 mA for all pins) and VDDEH is within the operating voltage specifications.

10. Internal structures hold the input voltage less than the maximum voltage on all pads powered by VDDE supplies, if the

maximum injection current specification is met (2 mA for all pins) and VDDE is within the operating voltage specifications.

11. Total injection current for all pins (including both digital and analog) must not exceed 25 mA.

12. Total injection current for all analog input pins must not exceed 15 mA.

13. Lifetime operation at these specification limits is not guaranteed.

14. Solder profile per CDF-AEC-Q100.

15. Moisture sensitivity per JEDEC test method A112.

Table 10. Thermal characteristics for 144-pin LQFP

Symbol

Parameter

Conditions

Value

Unit

RJA

D Junction-to-Ambient, Natural Convection(1)

Single layer board – 1s

°C/W

RJA

D Junction-to-Ambient, Natural Convection(2)

Four layer board – 2s2p

°C/W

RJMA

D Junction-to-Ambient (@200 ft/min)(2)

Single layer board –1s

°C/W

RJMA

D Junction-to-Ambient (@200 ft/min)(2)

Four layer board – 2s2p

°C/W

RJB

D Junction-to-Board(2)

°C/W

RJCtop

D Junction-to-Case (Top)(3)

8°C/W



Junction-to-Package Top, Natural

Convection(4)

2°C/W

Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board meets

JEDEC specification for this package.

Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC specification

for the specified package.

Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is

used for the case temperature. Reported value includes the thermal resistance of the interface layer.

Thermal characterization parameter indicating the temperature difference between the package top and the junction

temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written

as Psi-JT.

Table 11. Thermal characteristics for 176-pin LQFP

Symbol

Parameter

Conditions

Value

Unit

RJA

D Junction-to-Ambient, Natural Convection(1)

Single layer board - 1s

°C/W

RJA

D Junction-to-Ambient, Natural Convection(2)

Four layer board - 2s2p

°C/W

RJMA

D Junction-to-Moving-Air, Ambient(2)

@200 ft./min., single

layer board - 1s

°C/W

RJMA

D Junction-to-Moving-Air, Ambient(2)

@200 ft./min., four layer

board - 2s2p

°C/W

RJB

D Junction-to-Board(2)

°C/W

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