Table 35. TFBGA160 (7x11x1.2 mm) package mechanical data

Ref

Dimensions (mm)

Min.

Typ.

Max.

A(1)

-

-

1.20

A1

0.20

-

-

A2

-

0.27

-

A4

-

0.585

-

b(2)

0.30

0.35

0.40

D

6.85

7.00

7.15

D1

-

5.85

-

E

10.85

11.00

11.15

E1

-

9.75

-

e

-

0.65

-

Z (along X axis)

-

0.575

-

z (along Y axis)

-

0.625

-

ddd

-

-

0.10

eee(3)

-

-

0.15

fff(4)

-

-

0.08

1. TFBGA stands for Thin Profile Fine Pitch Ball Grid Array.

•

Thin Profile: The total profile height (Dim A) is measured from the seating plane to the top of the component.

•

The maximum total package height is calculated by the following methodology:

A Max. = A1 Typ + A3 Typ + A4 Typ + √ (A1²+A3²+A4² tolerance values).

•

Thin profile: 1.00 mm < A ≤ 1.20 mm / Fine pitch: e < 1.00 mm pitch.

2. The typical ball diameter before mounting is 0.35 mm.

3. The tolerance of position that controls the location of the pattern of balls with respect to datums A and B. For each ball there

is a cylindrical tolerance zone eee perpendicular to datum C and located on true position with respect to datums A and B as

defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone.

4. The tolerance of position that controls the location of the balls within the matrix with respect to each other. For each ball

there is a cylindrical tolerance zone fff perpendicular to datum C and located on true position as defined by e. The axis

perpendicular to datum C of each ball must lie within this tolerance zone. Each tolerance zone fff in the array is contained

entirely in the respective zone eee above The axis of each ball must lie simultaneously in both tolerance zones.

STA8135G

Package information

DS14788 - Rev 1

page 35/41