POWER DISSIPATION

SC-88A

PD-SC-88A-(85125150)-JE-A

i

The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.

The following conditions are used in this measurement.

Measurement Conditions

Item

Standard Test Land Pattern

Environment

Mounting on Board (Wind Velocity = 0 m/s)

Board Material

Glass Cloth Epoxy Plastic (Double-Sided Board)

Board Dimensions

40 mm × 40 mm × 1.6 mm

Copper Ratio

Top Side: Approx. 50%

Bottom Side: Approx. 50%

Through-holes

φ

0.5 mm × 44 pcs

Measurement Result

(Ta = 25°C, Tjmax = 125°C)

Item

Standard Test Land Pattern

Power Dissipation

380 mW

Thermal Resistance (θja)

θ

ja = 263°C/W

Thermal Characterization Parameter (ψjt)

ψjt = 75°C/W

θ

ja: Junction-to-Ambient Thermal Resistance

ψjt: Junction-to-Top Thermal Characterization Parameter

40

Power Dissipation vs. Ambient Temperature

Measurement Board Pattern

The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.

Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of

use and the total years of use must be limited as follows:

Total Hours of Use

Total Years of Use (4 hours/day)

13,000 hours

9 years

0

100

200

300

400

500

600

0

25

50

75

100

125

150

Ambient Temperature (°C)

85

475

380