POWER DISSIPATION

SOT-23-5

PD-SOT-23-5-(85/125/150)-JE-A

i

The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.

The following measurement conditions are based on JEDEC STD. 51-7.

Measurement Conditions

Item

Measurement Conditions

Environment

Mounting on Board (Wind Velocity = 0 m/s)

Board Material

Glass Cloth Epoxy Plastic (Four-Layer Board)

Board Dimensions

76.2 mm × 114.3 mm × 0.8 mm

Copper Ratio

Outer Layer (First Layer): Less than 95% of 50 mm Square

Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square

Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square

Through-holes

φ

0.3 mm × 7 pcs

Measurement Result

(Ta = 25°C, Tjmax = 125°C)

Item

Measurement Result

Power Dissipation

660 mW

Thermal Resistance (θja)

θ

ja = 150°C/W

Thermal Characterization Parameter (ψjt)

ψjt = 51°C/W

θ

ja: Junction-to-Ambient Thermal Resistance

ψjt: Junction-to-Top Thermal Characterization Parameter

Power Dissipation vs. Ambient Temperature

Measurement Board Pattern

The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.

Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of

use and the total years of use must be limited as follows:

Total Hours of Use

Total Years of Use (4 hours/day)

13,000 hours

9 years

0

100

200

300

400

500

600

700

800

900

1000

0

25

50

75

100

125

150

Ambient Temperature (

°C)

85

830

660