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S7G2 Datasheet(PDF) 6 Page - Renesas Technology Corp

Part # S7G2
Description  S7G2 Microcontroller Group
PDF  117 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

S7G2 Datasheet(HTML) 6 Page - Renesas Technology Corp

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R01DS0262EU0150 Rev.1.50
Page 6 of 117
Sep 24, 2025
S7G2 Datasheet
1. Overview
USB 2.0 High-Speed (USBHS)
module
The USB 2.0 High-Speed (USBHS) module can operate as a host controller or a device
controller. As a host controller, the USBHS supports high-speed transfer, full-speed transfer,
and low-speed transfer as defined in Universal Serial Bus Specification 2.0. As a device
controller, the USBHS supports high-speed transfer and full-speed transfer as defined in
Universal Serial Bus Specification 2.0. The USBHS has an internal USB transceiver and
supports all of the transfer types defined in Universal Serial Bus Specification 2.0.
The USBHS has FIFO buffers for data transfer, providing a maximum of 10 pipes. Any
endpoint number can be assigned to pipes 1 to 9, based on the peripheral devices or your
system for communication. See section 33, USB 2.0 High-Speed Module (USBHS) in Userʼs
Manual.
Ethernet MAC with IEEE 1588 PTP
(ETHERC)
Two-channel Ethernet MAC Controller (ETHERC) compliant with the Ethernet/IEEE802.3
Media Access Control (MAC) layer protocol. Each ETHERC channel provides one channel of
the MAC layer interface, connecting the MCU to the physical layer LSI (PHY-LSI) that allows
transmission and reception of frames compliant with the Ethernet and IEEE802.3 standards.
The ETHERC is connected to the Ethernet DMA Controller (EDMAC) so data can be
transferred without using the CPU.
To handle timing and synchronization between devices, an on-chip Precision Time Protocol
(PTP) module for the Ethernet PTP Controller (EPTPC) applies the PTP defined in the IEEE
1588-2008 version 2.0 standard.
The EPTPC is composed of:
 Synchronization Frame Processing units (SYNFP0 and SYNFP1)
 A Packet Relation Controller unit (PRC-TC)
 A Statistical Time Correction Algorithm unit (STCA).
Use the EPTPC in combination with the on-chip Ethernet MAC Controller (ETHERC) and the
DMA Controller for the PTP Ethernet Controller (PTPEDMAC). See section 29, Ethernet MAC
Controller (ETHERC) in Userʼs Manual.
SD/MMC Host Interface (SDHI)
The SDHI and MultiMediaCard (MMC) interface module provides the functionality required to
connect a variety of external memory cards to the MCU. The SDHI supports both 1-bit and 4-
bit buses for connecting memory cards that support SD, SDHC, and SDXC formats. When
developing host devices that are compliant with the SD Specifications, you must comply with
the SD Host/Ancillary Product License Agreement (SD HALA).
The MMC interface supports 1-bit, 4-bit, and 8-bit MMC buses that provide eMMC 4.51
(JEDEC Standard JESD 84-B451) device access. This interface also provides backward
compatibility and supports high-speed SDR transfer modes. See section 43, SD/MMC Host
Interface (SDHI) in Userʼs Manual.
Table 1.9
Analog
Feature
Functional description
12-bit A/D Converter (ADC12)
Two units of successive approximation 12-bit A/D Converter (ADC12) are provided. Analog
input channels are selectable up to 13 in unit 0 and up to 12 in unit 1. Each 2 analog inputs of
unit 0 and 1 are assigned to same port (AN005/AN105, AN006/AN106), up to 23 ports are
available as analog input. The temperature sensor output and an internal reference voltage are
selectable for conversion of each unit 0 and 1. The A/D conversion accuracy is selectable from
12-bit, 10-bit, and 8-bit conversion, making it possible to optimize the tradeoff between speed
and resolution in generating a digital value. See section 47, 12-Bit A/D Converter (ADC12) in
Userʼs Manual.
12-bit D/A Converter (DAC12)
A 12-bit D/A Converter (DAC12) converts data and includes an output amplifier. See section
48, 12-Bit D/A Converter (DAC12) in Userʼs Manual.
Temperature sensor (TSN)
The on-chip Temperature Sensor (TSN) can determine and monitor the die temperature for
reliable operation of the device. The sensor outputs a voltage directly proportional to the die
temperature, and the relationship between the die temperature and the output voltage is linear.
The output voltage is provided to the ADC12 for conversion and can also be used by the end
application. See section 49, Temperature Sensor (TSN) in Userʼs Manual.
High-Speed Analog Comparator
(ACMPHS)
The High-Speed Analog Comparator (ACMPHS) compares a test voltage with a reference
voltage and provides a digital output based on the conversion result.
Both the test and reference voltages can be provided to the comparator from internal sources
such as the DAC12 output and internal reference voltage, and an external source with or
without an internal PGA.
Such flexibility is useful in applications that require go/no-go comparisons to be performed
between analog signals without necessarily requiring A/D conversion. See section 50, High-
Speed Analog Comparator (ACMPHS) in Userʼs Manual.
Table 1.8
Communication interfaces (2 of 2)
Feature
Functional description



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