AFE5804 datasheet(2/60 Pages) TI

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ABSOLUTE MAXIMUM RATINGS

(1)

AFE5804

SBOS442A – JUNE 2008 – REVISED SEPTEMBER 2008 ................................................................................................................................................ www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGING/ORDERING INFORMATION(1)(2)

OPERATING

PACKAGE

TEMPERATURE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

DESIGNATOR

RANGE

NUMBER

MEDIA, QUANTITY

ECO STATUS

AFE5804ZCFR

Tape and Reel, 1000

AFE5804

µFBGA-135

ZCF

0°C to +85°C

AFE5804ZCFT

Tape and Reel, 250

Pb-Free, Green

AFE5804ZCF

Tray, 160

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

These packages conform to Lead (Pb)-free and green manufacturing specifications. Additional details including specific material content

can be accessed at www.ti.com/leadfree.

GREEN: TI defines Green to mean Lead (Pb)-Free and in addition, uses less package materials that do not contain halogens, including

bromine (Br), or antimony (Sb) above 0.1%of total product weight. N/A: Not yet available Lead (Pb)-Free; for estimated conversion

dates, go to www.ti.com/leadfree. Pb-FREE: TI defines Lead (Pb)-Free to mean RoHS compatible, including a lead concentration that

does not exceed 0.1% of total product weight, and, if designed to be soldered, suitable for use in specified lead-free soldering

processes.

Over operating free-air temperature range, unless otherwise noted.

AFE5804

UNIT

Supply voltage range, AVDD1

–0.3 to +3.9

Supply voltage range, AVDD2

–0.3 to +3.9

Supply voltage range, AVDD_5V

–0.3 to +6

Supply voltage range, DVDD

–0.3 to +3.9

Supply voltage range, LVDD

–0.3 to +2.2

Voltage between AVSS1 and LVSS

–0.3 to +0.3

Voltage at analog inputs

–0.3 to minimum [3.6, (AVDD2 + 0.3)]

External voltage applied to REFT-pin

–0.3 to +3

External voltage applied to REFB-pin

–0.3 to +2

Voltage at digital inputs

–0.3 to minimum [3.9, (AVDD2 + 0.3)]

Peak solder temperature(2)

+260

°C

Maximum junction temperature, TJ

+125

°C

Storage temperature range

–55 to +150

°C

Operating temperature range

0 to +85

°C

HBM

2000

ESD ratings

CDM

750

150

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

(2)

Device complies with JSTD-020D.

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