IMX35 datasheet(4/148 Pages) FREESCALE

4 / 148 page

i.MX35 Applications Processors for Automotive Products, Rev. 6

Freescale Semiconductor

The ball map for silicon revision 2.1 is different than the ballmap for silicon revision 2.0. The layout for

each revision is not compatible, so it is important that the correct ballmap be used to implement the layout.

See Section 5, “Package Information and Pinout.”

Table 2 shows the functional differences between the different parts in the i.MX35 family.

i.MX356

MCIMX356AJQ4C

2.1

5284

400MHz

-40 to 85

Table 92

Table 94

i.MX356

MCIMX356AJQ5C

2.1

5284

532MHz

-40 to 85

Table 92

Table 94

1 Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers

indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010:

Indicated by the Icon (!)

2 Case 5284 is RoHS-compliant, lead-free, MSL = 3, 1.

Table 2. Functional Differences in the i.MX35 Parts

Module

MCIMX351

MCIMX355

MCIMX356

I2C (3)

Yes

CSPI (2)

Yes

SSI/I2S (2)

Yes

ESAI

Yes

SPDIF I/O

Yes

USB HS Host

Yes

USB OTG

Yes

FlexCAN (2)

Yes

MLB

Yes

Ethernet

Yes

1-Wire

Yes

KPP

Yes

SDIO/MMC (2)

Yes

SDIO/Memory Stick

Yes

External Memory Controller (EMC)

Yes

JTAG

Yes

PATA

—Yes

Yes

CE-ATA

—Yes

Yes

Table 1. Ordering Information (continued)

Description

Part Number1

Silicon

Revision

Package2

Speed

Operating

Temperature

Range (

°C)

Signal Ball

Map

Locations

Ball Map

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