IMX35 datasheet(1/148 Pages) FREESCALE

Part #	IMX35

Description	i.MX35 Applications Processors for Automotive Products

PDF	148 Pages

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Manufacturer	FREESCALE [Freescale Semiconductor, Inc]

Direct Link	http://www.freescale.com

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Freescale Semiconductor

Data Sheet: Advance Information

Document Number: MCIMX35SR2AEC

Rev. 6, 10/2009

This document contains information on a product under development. Freescale reserves the

right to change or discontinue this product without notice.

IMX35

Package Information

Plastic package

Case 5284 17 x 17 mm, 0.8 mm Pitch

Ordering Information

See Table 1 on page 3 for ordering information.

1

Introduction

The i.MX35 Auto Application Processor family is

designed for automotive infotainment and

navigation applications. These processors are

AECQ100 Grade 3 qualified and rated for ambient

operating temperatures up to 85

°C.

The i.MX35 multimedia applications processor

represents the next step in low-power,

high-performance application processors.

Based on an ARM11 microprocessor core running

at up to 532 MHz, the device offers the following

features and optimized system cost for the target

applications.

•

Audio connectivity and telematics:

— Compressed audio playback from

storage devices (CD, USB, HDD or SD

card)

— PlayFromDevice (1-wire and 2-wire

support) for portable media players

i.MX35 Applications

Processors for

Automotive Products

Silicon Revisions 2.0 and 2.1

1

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1

Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.2

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3

1.3

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2

Functional Description and Application Information . . . . . 5

2.1

Application Processor Domain Overview. . . . . . . . . 5

2.2

Shared Domain Overview . . . . . . . . . . . . . . . . . . . . 6

2.3

Advanced Power Management Overview . . . . . . . . 6

2.4

ARM11 Microprocessor Core . . . . . . . . . . . . . . . . . 6

2.5

Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3

Signal Descriptions: Special Function Related Pins . . . . 12

4

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13

4.1

i.MX35 Chip-Level Conditions . . . . . . . . . . . . . . . . 13

4.2

Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

4.3

Supply Power-Up/Power-Down Requirements and

Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

4.4

Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

4.5

Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 19

4.6

Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . 20

4.7

I/O Pin DC Electrical Characteristics . . . . . . . . . . . 22

4.8

I/O Pin AC Electrical Characteristics . . . . . . . . . . . 25

4.9

Module-Level AC Electrical Specifications. . . . . . . 31

5

Package Information and Pinout . . . . . . . . . . . . . . . . . . 132

5.1

MAPBGA Production Package 1568-01, 17

× 17 mm,

0.8 Pitch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133

5.2

MAPBGA Signal Assignments. . . . . . . . . . . . . . . 134

6

Product Documentation. . . . . . . . . . . . . . . . . . . . . . . . . 147

7

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147

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