ADS1178IPAPR datasheet(28/39 Pages) TI1

28 / 39 page

PowerPAD THERMALLY-ENHANCED

ICDie

WireBond

LeadframeDiePad

ExposedatBaseofPackage

DieAttachEpoxy

(thermallyconductive)

Leadframe

MoldCompount

(Epoxy)

ADS1174

ADS1178

SBAS373B – OCTOBER 2007 – REVISED SEPTEMBER 2008 ........................................................................................................................................ www.ti.com

the PCB using standard flow soldering techniques.

PACKAGING

This soldering allows efficient attachment to the PCB

and permits the board structure to be used as a

The PowerPAD concept is implemented in standard

heat-sink for the package. Using a thermal pad

epoxy resin package material. The integrated circuit

identical in size to the die pad and vias connected to

is attached to the leadframe die pad using thermally

the PCB ground plane, the board designer can now

conductive epoxy. The package is molded so that the

implement

power

packaging

without

additional

leadframe die pad is exposed at a surface of the

thermal hardware (for example, external heat sinks)

package. This exposure provides an extremely low

or the need for specialized assembly instructions.

thermal resistance to the path between the IC

junction and the exterior case. The external surface

Figure 29 illustrates a cross-section view of a

of the leadframe die pad is located on the PCB side

PowerPAD package.

of the package, allowing the die pad to be attached to

Figure 29. Cross-Section View of a PowerPAD Thermally-Enhanced Package

Submit Documentation Feedback

Product Folder Link(s): ADS1174 ADS1178

ADS1178IPAPR Datasheet(PDF) 28 Page - Texas Instruments

ADS1178IPAPR Datasheet(HTML) 28 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39

Datasheet Download

Link URL