Q6000 datasheet(5/98 Pages) INTEL

5 / 98 page

Datasheet

Figures

1VCC Static and Transient Tolerance ............................................................................. 20

2VCC Overshoot Example Waveform ............................................................................. 21

Differential Clock Waveform ...................................................................................... 29

Differential Clock Crosspoint Specification ................................................................... 30

Differential Measurements......................................................................................... 30

Processor Package Assembly Sketch ........................................................................... 31

Processor Package Drawing Sheet 1 of 3 ..................................................................... 32

Processor Package Drawing Sheet 2 of 3 ..................................................................... 33

Processor Package Drawing Sheet 3 of 3 ..................................................................... 34

10 Processor Top-Side Markings Example for 1066 MHz Processors ..................................... 36

11 Processor Top-Side Markings Example for 1333 MHz Processors ..................................... 37

12 Processor Land Coordinates and Quadrants (Top View) ................................................. 38

13 land-out Diagram (Top View – Left Side) ..................................................................... 40

14 land-out Diagram (Top View – Right Side) ................................................................... 41

15 Thermal Profile for 130 W Processors.......................................................................... 73

16 Thermal Profile for 105 W Processors.......................................................................... 74

17 Thermal Profile 95 W Processors ................................................................................ 75

18 Case Temperature (TC) Measurement Location ............................................................ 76

19 Thermal Monitor 2 Frequency and Voltage Ordering ...................................................... 78

20 Conceptual Fan Control on PECI-Based Platforms ......................................................... 80

21 Processor Low Power State Machine ........................................................................... 84

22 Mechanical Representation of the Boxed Processor ....................................................... 87

23 Space Requirements for the Boxed Processor (Side View).............................................. 88

24 Space Requirements for the Boxed Processor (Top View)............................................... 89

25 Space Requirements for the Boxed Processor (Overall View) .......................................... 89

26 Boxed Processor Fan Heatsink Power Cable Connector Description .................................. 91

27 Baseboard Power Header Placement Relative to Processor Socket ................................... 92

28 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 1 View)................... 93

29 Boxed Processor Fan Heatsink Airspace Keepout Requirements (Side 2 View)................... 93

30 Boxed Processor Fan Heatsink Set Points..................................................................... 95

Q6000 Datasheet(PDF) 5 Page - Intel Corporation