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VN771K Datasheet(PDF) 26 Page - STMicroelectronics |
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VN771K Datasheet(HTML) 26 Page - STMicroelectronics |
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26 / 33 page ![]() Thermal data VN771K 26/33 Doc ID 12534 Rev 4 4 Thermal data 4.1 SO-28 thermal data Figure 47. SO-28 PC board Note: Layout condition of Rth and Zth measurements (PCB FR4 area = 58mm x 58mm, PCB thickness = 2mm, Cu thickness = 35µm, Copper areas: from minimum pad layout to 6cm2). Figure 48. Chipset configuration Figure 49. Auto and mutual Rthj-amb vs PCB copper area in open box free air condition(a) a. see definitions in Section 5.2 on page 31 LOW SIDE CHIP channel 3 RthB LOW SIDE CHIP channel 4 RthC HIGH SIDE CHIP channel 1,2 RthA RthAB RthAC RthBC |
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