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AT25DF512C Datasheet(PDF) 37 Page - List of Unclassifed Manufacturers

Part # AT25DF512C
Description  512-Kbit, 1.65V Minimum SPI Serial Flash Memory with Dual-I/O Support
PDF  40 Pages
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Manufacturer  ETC2 [List of Unclassifed Manufacturers]
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AT25DF512C Datasheet(HTML) 37 Page - List of Unclassifed Manufacturers

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37
AT25DF512C
DS-25DF512C–030A–4/2014
16.3
8X-TSSOP
DRAWING NO.
REV.
TITLE
GPC
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A
-
-
1.20
A1
0.05
-
0.15
A2
0.80
1.00
1.05
D
2.90
3.00
3.10
2, 5
E
6.40 BSC
E1
4.30
4.40
4.50
3, 5
b
0.19
–
0.30
4
e
0.65 BSC
L
0.45
0.60
0.75
L1
1.00 REF
C
0.09
-
0.20
Side View
End View
Top View
A2
A
L
L1
D
1
E1
N
b
Pin 1 indicator
this corner
E
e
Notes:
1. This drawing is for general information only. Refer to JEDEC
Drawing MO-153, Variation AA, for proper dimensions,
tolerances, datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate
burrs. Mold Flash, protrusions and gate burrs shall not exceed
0.15mm (0.006in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions.
Inter-lead Flash and protrusions shall not exceed 0.25mm
(0.010in) per side.
4. Dimension b does not include Dambar protrusion. Allowable
Dambar protrusion shall be 0.08mm total in excess of the b
dimension at maximum material condition. Dambar cannot be
located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07mm.
5. Dimension D and E1 to be determined at Datum Plane H.
H
8X
E
12/8/11
8X, 8-lead 4.4mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP)
TNR
C
A1
Package Drawing Contact:
contact@adestotech.com
®



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