AN4488 datasheet(18/44 Pages) STMICROELECTRONICS

18 / 44 page

Package

AN4488

18/44

DocID026304 Rev 3

Package

3.1

Package Selection

Package should be selected by taking into account the constrains that are strongly

dependent upon the application.

The list below summarizes the more frequent ones:

–

Amount of interfaces required.

Some interfaces might not be available on some packages.

Some interfaces combinations could not be possible on some packages

–

PCB technology constrains.

Small pitch and high ball density could require more PCB layers and higher class

PCB

–

Package height

–

PCB available area

–

Noise emission or signal integrity of high speed interfaces.

Smaller packages usually provide better signal integrity. This is further enhanced

as Small pitch and high ball density requires multilayer PCBs which allow better

supply/ground distribution.

–

Compatibility with other devices.

Table 4. Package summary (Excluding WCSP)

Size (mm)(1)

Pitch (mm)

0.5

0.8

0.5

0.65

0.5

0.8

Height (mm)

0.6

1.6

0.6

1.6

0.6

1.6

0.6

1.6

1.1

Sales numbers

STM32F405xx / 407xx

/ 415xx / 417xx

-X

X-

-X-X-

STM32F42xxx / 43xxx

XXXX

STM32F401xB/C

XXXX

-------

STM32F401xD/E

XXXX

-------

STM32F411xx

XXXX

----

STM32F446XX

----

1. body size, excluding pins

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