MB9AF112K datasheet(82/89 Pages) SPANSION

82 / 89 page

DataS h eet

February 20, 2015, MB9A110K-DS706-00030-2v0-E

CONFIDENTIAL



Package Dimensions

48-pin plastic LQFP

Lead pitch

0.50 mm

Package width ×

package length

7.00 mm × 7.00 mm

Lead shape

Gullwing

Lead bend

direction

Normal bend

Sealing method

Plastic mold

Mounting height

1.70 mm MAX

Weight

0.17 g

48-pin plastic LQFP

(FPT-48P-M49)

2010 FUJITSU SEMICONDUCTOR LIMITED HMbF48-49Sc-1-2

INDEX

*7.00± 0.10(.276 ± .004)SQ

9.00 ± 0.20(.354 ± .008)SQ

0.145± 0.055

(.006 ± .002)

0.08(.003)

"A"

0°~8°

.059–.004

+.008

–0.10

+0.20

1.50

0.60 ± 0.15

(.024 ± .006)

0.10 ± 0.10

(.004 ± .004)

(Stand off)

0.25(.010)

Details of "A" part

0.08(.003) M

(.008± .002)

0.22 ± 0.05

0.50(.020)

(Mounting height)

Dimensions in mm (inches).

Note: The values in parentheses are reference values.

Note 1) * : These dimensions do not include resin protrusion.

Note 2) Pins width and pins thickness include plating thickness.

Note 3) Pins width do not include tie bar cutting remainder.

MB9AF112K Datasheet(PDF) 82 Page - SPANSION

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