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MB9AF112K Datasheet(PDF) 85 Page - SPANSION

Part # MB9AF112K
Description  This document states the current technical specifications regarding
PDF  89 Pages
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Manufacturer  SPANSION [SPANSION]
Direct Link  http://www.spansion.com
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MB9AF112K Datasheet(HTML) 85 Page - SPANSION

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D a t a S h e e t
82
MB9A110K-DS706-00030-2v0-E, February 20, 2015
CONFIDENTIAL
 Major Changes
Page
Section
Change Results
Revision 1.0
-
-
PRELIMINARY → Data sheet
7
PRODUCT LINEUP
Function
Added the pin count.
8
PACKAGES
Revised from "Planning".
23
I/O CIRCUIT TYPE
Corrected the following description to "TypeB".
Digital output → Digital input
34
BLOCK DIAGRAM
Corrected the following description.
AHB (Max 40MHz) → AHB (Max 42MHz)
APB0 (Max 40MHz) → APB0 (Max 42MHz)
APB1 (Max 40MHz) → APB1 (Max 42MHz)
APB2 (Max 40MHz) → APB2 (Max 42MHz)
Deleted the description for "USB Clock Ctrl / PLL".
45, 46
ELECTRICAL CHARACTERISTICS
3. DC Characteristics
(1) Current Rating
Revised the value of "TBD".
Corrected the value.
- Power supply current (ICCR)
Typ: 60 → 50
- Power supply current (ICCRD) (RAM hold off)
Typ: 45 → 30
- Power supply current (ICCRD) (RAM hold on)
Typ: 48 → 33
61
(9) External Input Timing
Revised the value of "TBD".
66
5. 12-bit A/D Converter
Electrical characteristics for the A/D
converter
Deleted "(Preliminary value)".
Corrected the value of "Compare clock cycle".
Max: 10000 → 2000
70
7. MainFlash Memory Write/Erase
Characteristics
Erase/write cycles and data hold time
Deleted"(targeted value)".
8. WorkFlash Memory Write/Erase
Characteristics
Erase/write cycles and data hold time
Revision 1.1
-
-
Company name and layout design change
Revision 2.0
25
I/O Circuit Type
Added the description of I
2C to the type of E and F
25, 26
I/O Circuit Type
Added about +B input
32
Handling Devices
Added "Stabilizing power supply voltage"
32
Handling Devices
Crystal oscillator circuit
Added the following description
"Evaluate oscillation of your using crystal oscillator by your mount board."
33
Handling Devices
C Pin
Changed the description
34
Block Diagram
Modified the block diagram
35
Memory Map
· Memory map(1)
Modified the area of "Extarnal Device Area"
36
Memory Map
· Memory map(2)
Added the summary of Flash memory sector and the note
43, 44
Electrical Characteristics
1. Absolute Maximum Ratings
· Added the Clamp maximum current
· Added the output current of P80 and P81
· Added about +B input
45
Electrical Characteristics
2. Recommended Operation Conditions
· Modified the minimum value of Analog reference voltage
· Added Smoothing capacitor
· Added the note about less than the minimum power supply voltage
46-48
Electrical Characteristics
3. DC Characteristics
(1) Current rating
· Changed the table format
· Added Main TIMER mode current
· Added Flash Memory Current
· Moved A/D Converter Current
51
Electrical Characteristics
4. AC Characteristics
(1) Main Clock Input Characteristics
Added Master clock at Ingernal operating clock frequency
52
Electrical Characteristics
4. AC Characteristics
(3) Built-in CR Oscillation Characteristics
Added Frequency stability time at Built-in high-speed CR



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