4

LP5922

SNVSAG0 – NOVEMBER 2016

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

(4)

Internal thermal shutdown circuitry protects the device from permanent damage.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

–0.3

7

V

–0.3

7

V

–0.3

7

V

–0.3

3.6

V

–0.3

3.6

V

150

°C

Internally limited

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

±2000

V

±1000

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

1.3

6

V

0.5

5

V

0.5

V

0

V

0

2

A

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

(2)

Conductivity Test Board for Leaded Surface Mount Packages.

(3)

EIA/JEDEC JESD51-5.

6.4 Thermal Information

LP5922

UNIT

DSC (WSON)

10 PINS

(2)

Junction-to-ambient thermal resistance, High K

°C/W

Junction-to-case (top) thermal resistance

38.2

°C/W

Junction-to-board thermal resistance

24.0

°C/W

Junction-to-top characterization parameter

0.5

°C/W

Junction-to-board characterization parameter

24.1

°C/W

Junction-to-case (bottom) thermal resistance

6.0

°C/W