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ADC08D1000EVAL Datasheet(PDF) 10 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # ADC08D1000EVAL
Description  High Performance, Low Power, Dual 8-Bit, 1 GSPS A/D Converter
PDF  31 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

ADC08D1000EVAL Datasheet(HTML) 10 Page - National Semiconductor (TI)

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Converter Electrical Characteristics (Continued)
[Note: This product is currently in development. As such, the parameters specified in this section are DESIGN TAR-
GETS. The specifications in this section cannot be guaranteed until device characterization has taken place.]
The following specifications apply after calibration for V
A =VDR = +1.9VDC, OutV = 1.9V, VIN FSR (a.c. coupled) = differential
800mV
P-P,CL = 10 pF, Differential, a.c. coupled Sinewave Input Clock, fCLK = 1 GHz at 0.5VP-P with 50% duty cycle, Non-
Extended Control Mode, R
EXT = 3300
Ω ±0.1%, Analog Signal Source Impedance = 100Ω. Boldface limits apply for T
A =
T
MIN to TMAX. All other limits TA = 25˚C, unless otherwise noted. (Notes 6, 7)
Symbol
Parameter
Conditions
Typical
(Note 8)
Limits
(Note 8)
Units
(Limits)
DIGITAL OUTPUT CHARACTERISTICS
I
OS
Output Short Circuit Current
Output+ & Output- connected to
0.8V
−4
mA
Z
O
Differential Output Impedance
100
Ohms
POWER SUPPLY CHARACTERISTICS
I
A
Analog Supply Current
PD = PDQ = Low
PD = Low, PDQ = High
PD = High
627
325
4.3
690
360
mA (max)
mA
mA
I
DR
Output Driver Supply Current
PD = PDQ = Low
PD = Low, PDQ = High
PD = PDQ = High
202
116
1
257
135
mA (max)
mA (max)
mA
P
D
Power Consumption
PD = PDQ = Low
PD = Low, PDQ = High
PD = PDQ = High
1.6
0.84
20
1.8
0.94
W (max)
W
mW
PSRR1
D.C. Power Supply Rejection Ratio
Change in Full Scale Error with
change in V
A from 1.8V to 2.0V
73
dB
PSRR2
A.C. Power Supply Rejection Ratio
248 MHz, 50mV
P-P riding on VA
TBD
dB
AC ELECTRICAL CHARACTERISTICS
f
CLK1
Maximum Conversion Rate
T
A
≤ 85˚C
1.1
1.0
GHz (min)
T
A
≤ 75˚C
1.3
GHz
f
CLK2
Minimum Conversion Rate
200
MHz
Input Clock Duty Cycle
200 MHz
≤ Input clock frequency ≤
1 GHz
50
20
80
% (min)
% (max)
t
CL
Input Clock Low Time
(Note 12)
500
200
ps (min)
t
CH
Input Clock High Time
(Note 12)
500
200
ps (min)
DCLK Duty Cycle
(Note 12)
50
45
55
% (min)
% (max)
t
RS
Reset Setup Time
(Note 12)
150
TBD
ps (min)
t
RH
Reset Hold Time
(Note 12)
250
TBD
ps (min)
t
RPW
Reset Pulse Width
4
Clock Cycles
(min)
t
LHT
Differential Low to High Transition
Time
10% to 90%, C
L = 2.5 pF
250
ps
t
HLT
Differential High to Low Transition
Time
10% to 90%, C
L = 2.5 pF
250
ps
t
OSK
DCLK to Data Output Skew
50% of DCLK transition to 50% of
Data transition, SDR Mode
and DDR Mode, 0˚ DCLK (Note 12)
±200
±TBD
ps (max)
t
SU
Data to DCLK Set-Up Time
DDR Mode, 180˚ DCLK (Note 12)
750
TBD
ps (min)
t
H
DCLK to Data Hold Time
DDR Mode, 180˚ DCLK (Note 12)
750
TBD
ps (min)
t
AD
Sampling (Aperture) Delay
Input CLK+ Fall to Acquisition of
Data
1.3
ns
t
AJ
Aperture Jitter
0.4
ps rms
t
OD
Input Clock to Data Output Delay
50% of Input Clock transition to
50% of Data transition
3.1
ns
www.national.com
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