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SPC563M64L7 Datasheet(PDF) 1 Page - STMicroelectronics |
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SPC563M64L7 Datasheet(HTML) 1 Page - STMicroelectronics |
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1 / 48 page  Data brief For further information contact your local STMicroelectronics sales office. September 2013 Doc ID 13850 Rev 6 1/48 1 SPC563Mxx 32-bit Power Architecture® based on MCU for automotive powertrain applications Features ■ Single issue, 32-bit Power Architecture® Book E compliant e200z335 CPU core complex – Includes variable length encoding (VLE) enhancements for code size reduction ■ 32-channel direct memory access controller (DMA) ■ Interrupt controller (INTC) capable of handling 364 selectable-priority interrupt sources: 191 peripheral interrupt sources, 8 software interrupts and 165 reserved interrupts. ■ Frequency-modulated phase-locked loop (FMPLL) ■ Calibration external bus interface (EBI)(a) ■ System integration unit (SIU) ■ Up to 1.5 Mbyte on-chip Flash with Flash controller – Fetch Accelerator for single cycle Flash access @80 MHz ■ Up to 94 Kbyte on-chip static RAM (including up to 32 Kbyte standby RAM) ■ Boot assist module (BAM) ■ 32-channel second-generation enhanced time processor unit (eTPU) – 32 standard eTPU channels – Architectural enhancements to improve code efficiency and added flexibility ■ 16-channels enhanced modular input-output system (eMIOS) ■ Enhanced queued analog-to-digital converter (eQADC) ■ Decimation filter (part of eQADC) ■ Silicon die temperature sensor ■ 2 deserial serial peripheral interface (DSPI) modules (compatible with Microsecond Bus) ■ 2 enhanced serial communication interface (eSCI) modules compatible with LIN ■ 2 controller area network (FlexCAN) modules that support CAN 2.0B ■ Nexus port controller (NPC) per IEEE-ISTO 5001-2003 standard ■ IEEE 1149.1 (JTAG) support ■ Nexus interface ■ On-chip voltage regulator controller that provides 1.2 V and 3.3 V internal supplies from a 5 V external source. ■ Designed for LQFP100, LQFP144, LQFP176 and LBGA208 packages. a. The external bus interface is only accessible when using the calibration tool. It is not available on production packages. LFBGA208 17 mm x 17 mm x1.5 mm LQFP144 20 mm x 20 mm LQFP100 14 mm x 14 mm LQFP176 24 mm x 24 m m Table 1. Device summary Memory Flash size Part number Package: LQFP100 Package: LQFP144 Package: LQFP176 Package: LBGA208 1536 Kbyte - SPC563M64L5 SPC563M64L7 - www.st.com |
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