13. Layout and packaging information

13.1. Mechanical dimensions

The packaging technology is a CSP with a uBGA. All measures which do not have an explicit tolerance are meant +/-0.001mm.

0.0075

top view (view to photosensitive side)

1

16

(ball size:

 0.200)

8.000 ±0.040

PCB side

Photosensitive side

(top view)

Solder balls Sn96.5Ag3.0Cu0.5

(SAC305)

Pixel #0

Pixel #1023

(0.250 ±0.020)

0.500

15 x 0.500 = 7.500

photosensitive area

4.000 ±0.020

1024 x 0.0075 = 7.680

center of pixel-field

32

17

- measures in mm

- not specified tolerances ±0.001

3.750

(0.090)

Weight: 4.57 mg

The following picture shows the epc901 chip from the bottom side with view to the solder balls. Please note the location of pin 1 and

pin 32.

13.2. Location of the photosensitive area

The photosensitive area is not marked neither on the front nor on the backside of the IC. As a visible reference, a metal ring of the IC can

be used. From the back side (solder ball side) it is visible. Also from the front side (photosensitive area) it can be seen with a camera which

is sensitive in the near infrared wavelength domain (950 .. 1150nm).

© 2016 ESPROS Photonics Corporation

Characteristics subject to change without notice

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Datasheet_epc901-V5.6

www.espros.com

Pin 1