Reference: CMV2000-datasheet-v3.8

CMV2000 v3 Datasheet

Page 7 of 63

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5.15.1 Adjusting registers for optimal performance ...............................................................................................42

6 Register overview ................................................................................................................................................43

7 Mechanical specifications ....................................................................................................................................46

7.1 Package drawing.........................................................................................................................................................46

7.1.1 95 pins µPGA and LGA....................................................................................................................................46

7.1.2 92 pins LCC ......................................................................................................................................................47

7.2 Assembly drawing ......................................................................................................................................................48

7.3 Cover glass ..................................................................................................................................................................49

7.4 Color filters .................................................................................................................................................................49

8 Response curve ....................................................................................................................................................51

9 Spectral response.................................................................................................................................................52

9.1 5µm epi devices..........................................................................................................................................................52

9.2 12µm epi devices........................................................................................................................................................52

10 Angular response .................................................................................................................................................53

11 Pinning .................................................................................................................................................................54

11.1 Pin list ..........................................................................................................................................................................54

11.2 µPGA and LGA pin layout...........................................................................................................................................56

11.3 LCC pin layout .............................................................................................................................................................56

12 Specification overview .........................................................................................................................................57

13 Ordering information ...........................................................................................................................................59

14 Handling and soldering procedure .......................................................................................................................60

14.1 Soldering .....................................................................................................................................................................60

14.1.1 Manual soldering ............................................................................................................................................60

14.1.2 Wave soldering ...............................................................................................................................................60

14.1.3 Reflow soldering .............................................................................................................................................61

14.1.4 Soldering recommendations..........................................................................................................................61

14.2 Handling image sensors .............................................................................................................................................61

14.2.1 ESD...................................................................................................................................................................61

14.2.2 Glass cleaning .................................................................................................................................................61

14.2.3 Image sensor storing ......................................................................................................................................61

15 Evaluation kit .......................................................................................................................................................62

16 Additional information.........................................................................................................................................63