SLDM-06D1Ax

47

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© 2016 Bel Power Solutions & Protection

Rev. AC

60. SURFACE MOUNT INFORMATION

Pick and Place

The SLDM-06D1Ax modules use an open frame construction and are designed for a fully automated assembly process. The modules

are fitted with a label designed to provide a large surface area for pick and place operations. The label meets all the requirements for

surface mount processing, as well as safety standards, and is able to withstand reflow temperatures of up to 300oC. The label also carries

product information such as product code, serial number and the location of manufacture.

Nozzle Recommendations

The module weight has been kept to a minimum by using open frame construction. Variables such as nozzle size, tip style, vacuum

pressure and placement speed should be considered to optimize this process. The minimum recommended inside nozzle diameter for

reliable operation is 3mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 7 mm.

Bottom Side / First Side Assembly

The modules are lead-free (Pb-free) and RoHS compliant and fully compatible in a Pb-free soldering process. Failure to observe the

instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability.

Lead Free Soldering

The modules are lead-free (Pb-free) and RoHS compliant and fully compatible in a Pb-free soldering process. Failure to observe the

instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability.

Pb-free Reflow Profile

Power Systems will comply with J-STD-020 Rev. D (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount

Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection

reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The

recommended linear reflow profile using Sn/Ag/Cu solder is shown in Fig. 50. Soldering outside of the recommended profile requires

testing to verify results and performance.

MSL Rating

The SLDM-06D1Ax modules have a MSL rating of 2A.