TMS320F28375DPZP datasheet(86/226 Pages) TI

86 / 226 page

Inactive

Device Active

CPU1 IDLE

Instruction

Enabled

Bypassed &

Powered -Down

Powered Down

Powering up

HIBERNATE

CPU1 Boot ROM

Device Status

INTOSC1,INTOSC2,

X1/X2

GPIOHIBWAKEn,

XRSn

PLLs

I/O Isolation

IoRestore() or Application Specific Operation

CPU1 HIB

config

(A)

(B)

(C)

(D)

tw(HIBWAKEn),

tw(XRSn)

(F)

(G)(H)

(I)(J)

XCLKCOUT

Application Specific Operation

Application SpecificOperation

(E)

td(IDLE-XCOS)

Td(WAKE-HIB)

A. CPU1 does necessary application-specific context save to M0/M1 memories if required. This includes GPIO state if using I/O Isolation.

Configures the LPMCR register of CPU1 for HIBERNATE mode. Powers down Flash Pump/Bank, USB-PHY, CMPSS, DAC, and ADC

using their register configurations. The application should also power down the PLL and peripheral clocks before entering HIBERNATE.

In dual-core applications, CPU1 should confirm that CPU2 has entered IDLE/STANDBY using the LPMSTAT register.

B. IDLE instruction is executed to put the device into HIBERNATE mode.

C. The device is now in HIBERNATE mode. If configured, I/O isolation is turned on, M0 and M1 memories are retained. CPU1 and CPU2

are powered down. Digital peripherals are powered down. The oscillators, PLLs, analog peripherals, and Flash are in their software-

controlled Low-Power modes. Dx, LSx, and GSx memories are also powered down, and their memory contents lost.

D. A falling edge on the GPIOHIBWAKEn pin will drive the wakeup of the devices clock sources INTOSC1, INTOSC2, and X1/X2 OSC. The

wakeup source must keep the GPIOHIBWAKEn pin low long enough to ensure full power-up of these clock sources.

E. After the clock sources are powered up, the GPIOHIBWAKEn must be driven high to trigger the wakeup sequence of the remainder of

the device.

F. The BootROM will then begin to execute. The BootROM can distinguish a HIBERNATE wakeup by reading the CPU1.REC.HIBRESETn

bit. After the TI OTP trims are loaded, the BootROM code will branch to the user-defined IoRestore function if it has been configured.

G. At this point, the device is out of HIBERNATE mode, and the application may continue.

H. The IoRestore function is a user-defined function where the application may reconfigure GPIO states, disable I/O isolation, reconfigure

the PLL, restore peripheral configurations, or branch to application code. This is up to the application requirements.

If the application has not branched to application code, the BootROM will continue after completing IoRestore. It will disable I/O isolation

automatically if it was not taken care of inside of IoRestore. CPU2 will be brought out of reset at this point as well.

J. BootROM will then boot as determined by the HIBBOOTMODE register. Refer to the ROM Code and Peripheral Booting chapter of the

TMS320F2837xD Dual-Core Microcontrollers Technical Reference Manual for more information.

Figure 8-20. HIBERNATE Entry and Exit Timing Diagram

Note

1. If the IORESTOREADDR is configured as the default value, the BootROM will continue its

execution to boot as determined by the HIBBOOTMODE register. Refer to the ROM Code and

Peripheral Booting chapter of the TMS320F2837xD Dual-Core Microcontrollers Technical

Reference Manual for more information.

2. The user may choose to disable I/O Isolation at any point in the IoRestore function. Regardless if

the user has disabled Isolation in the IoRestore function or if IoRestore is not defined, the

BootROM will automatically disable isolation before booting as determined by the HIBBOOTMODE

Note

For applications using both CPU1 and CPU2, TI recommends that the application puts CPU2 in either

IDLE or STANDBY before entering HIBERNATE mode. If any GPIOs are used and the state is to be

preserved, data can be stored in M0/M1 memory of CPU1 to be reconfigured upon wakeup. This

should be done before step A of Figure 8-20.

TMS320F28379D, TMS320F28379D-Q1, TMS320F28378D, TMS320F28377D

TMS320F28377D-Q1, TMS320F28376D, TMS320F28375D, TMS320F28374D

SPRS880O – DECEMBER 2013 – REVISED FEBRUARY 2021

www.ti.com

Submit Document Feedback

Product Folder Links: TMS320F28379D TMS320F28379D-Q1 TMS320F28378D TMS320F28377D

TMS320F28377D-Q1 TMS320F28376D TMS320F28375D TMS320F28374D

TMS320F28375DPZP Datasheet(PDF) 86 Page - Texas Instruments

TMS320F28375DPZP Datasheet(HTML) 86 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL