PIMXRT516SCVM2A datasheet(1/128 Pages) NXP

Part #	PIMXRT516SCVM2A

Description	i.MX RT1170 Crossover Processors Data Sheet for Consumer Products

PDF	128 Pages

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Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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1 / 128 page

NXP Semiconductors

Data Sheet: Technical Data

Document Number: IMXRT1170CEC

Rev. 1, 05/2021

MIMXRT1176DVMAA

MIMXRT1175DVMAA

MIMXRT1172DVMAA

MIMXRT1171DVMAA

MIMXRT117HDVMAA

MIMXRT117FDVMAA

Package Information

Plastic Package

289-pin MAPBGA, 14 x 14 mm, 0.8 mm pitch

Ordering Information

See Table 1 on page 6

NXP reserves the right to change the production detail specifications as may be required

to permit improvements in the design of its products.

1

i.MX RT1170 introduction

The i.MX RT1170 is a new high-end processor of i.MX

RT family, which features NXP’s advanced

implementation of a high performance Arm

Cortex®-M7 core operating at speeds up to 1 GHz and a

power efficient Cortex®-M4 core up to 400 MHz.

The i.MX RT1170 processor has 2 MB on-chip RAM in

total, including a 768 KB RAM which can be flexibly

configured as TCM (512 KB RAM shared with M7 TCM

and 256 KB RAM shared with M4 TCM) or

general-purpose on-chip RAM. The i.MX RT1170

integrates advanced power management module with

DCDC and LDO regulators that reduce complexity of

external power supply and simplifies power sequencing.

The i.MX RT1170 also provides various memory

interfaces, including SDRAM, RAW NAND FLASH,

NOR FLASH, SD/eMMC, Quad/Octal SPI, Hyper

RAM/Flash, and a wide range of other interfaces for

connecting peripherals, such as WLAN, Bluetooth™,

GPS, displays, and camera sensors. The i.MX RT1170

also has rich audio and video features, including MIPI

CSI/DSI, LCD display, graphic accelerator, camera

interface, SPDIF, and I2S audio interface.

i.MX RT1170 Crossover

Processors Data Sheet

for Consumer Products

1. i.MX RT1170 introduction . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 6

1.3. Package marking information . . . . . . . . . . . . . . . . 9

2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

3.1. Special signal considerations . . . . . . . . . . . . . . . 20

3.2. Recommended connections for unused analog

interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 24

4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 24

4.2. System power and clocks . . . . . . . . . . . . . . . . . . 36

4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 54

4.5. External memory interface . . . . . . . . . . . . . . . . . . 58

4.6. Display and graphics . . . . . . . . . . . . . . . . . . . . . . 68

4.7. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

4.8. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

4.9. Communication interfaces . . . . . . . . . . . . . . . . . . 85

4.10. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101

5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . 103

5.1. Boot mode configuration pins . . . . . . . . . . . . . . 103

5.2. Boot device interface allocation . . . . . . . . . . . . . 103

6. Package information and contact assignments . . . . . . 109

6.1. 14 x 14 mm package information . . . . . . . . . . . . 109

7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124

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