NXP Semiconductors

Data Sheet: Technical Data

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A3T09S100N Airfast RF Power LDMOS Transistor, Rev. 0, March 2021

Product Documentation, Software and Tools

Refer to the following documents, software and tools to aid your design process.

Application Notes

 AN1907: Solder Reflow Attach Method for High Power RF Devices in Plastic Packages

 AN1955: Thermal Measurement Methodology of RF Power Amplifiers

Engineering Bulletins

 EB212: Using Data Sheet Impedances for RF LDMOS Devices

Software

 Electromigration MTTF Calculator

 RF High Power Model

 .s2p File

Development Tools

 Printed Circuit Boards

Revision History

The following table summarizes revisions to this document.

Revision

Date

Description

0

Mar. 2021

 Initial release of data sheet