LPC86X datasheet(44/99 Pages) NXP

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LPC86x

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Product data sheet

Rev.3 — 28 April 2023

44 of 97

NXP Semiconductors

LPC86x

32-bit Arm Cortex-M0+ microcontroller

10. Thermal characteristics

The average chip junction temperature, Tj (C), can be calculated using the following

equation:

(1)

• Tamb = ambient temperature (C)

• Rth(j-a) = the package junction-to-ambient thermal resistance (C/W)

• PD = sum of internal and I/O power dissipation

The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of

the I/O pins is often small and many times can be negligible. However, it can be significant

in some applications.

[1]

Determined in accordance with JEDEC JESD51-2A natural convection environment. Thermal resistance

data in this report is solely for a thermal performance comparison of one package to another in a

standardized specified environment. It is not meant to predict the performance of a package in an

application-specific environment.

[2]

Thermal test board meets JEDEC specifications for this package (JESD51-7).

[3]

Junction-to-Case thermal resistance determined using an isothermal cold plate. Case temperature refers to

the mold surface temperature at the package’s top side dead center.

[4]

Junction-to-Case (bottom) thermal resistance determined using an isothermal cold plate. Case temperature

refers to the package’s bottom surface temperature.

Tamb

PD Rth j a

–







Table 11.

Thermal resistance

Symbol Parameter

Board Type

Value

Unit

LQFP64 package

RθJA

Junction to Ambient Thermal Resistance[1]

JESD51-7, 2s2p

C/W

RθJC

Junction to Case (Top) Thermal Resistance[3]

JESD51-7, 1s

C/W



Junction-to-Top of Package Thermal Characterization

Parameter[1]

JESD51-7, 2s2p

0.4

C/W

HVQFN48 package

RθJA

Junction to Ambient Thermal Resistance[1]

JESD51-7, 2s2p

C/W

RθJC

Junction to Case (Bottom) Thermal Resistance[4]

JESD51-7, 1s

2.4

C/W



Junction-to-Top of Package Thermal Characterization

Parameter[1]

JESD51-7, 2s2p

0.2

C/W

HVQFN32 package

RθJA

Junction to Ambient Thermal Resistance[1]

JESD51-7, 2s2p

C/W

RθJC

Junction to Case (Bottom) Thermal Resistance[4]

JESD51-7, 1s

2.0

C/W



Junction-to-Top of Package Thermal Characterization

Parameter[1]

JESD51-7, 2s2p

0.3

C/W

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