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LPC86X Datasheet(PDF) 87 Page - NXP Semiconductors |
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LPC86X Datasheet(HTML) 87 Page - NXP Semiconductors |
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87 / 99 page ![]() LPC86x All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2023. All rights reserved. Product data sheet Rev.3 — 28 April 2023 87 of 97 NXP Semiconductors LPC86x 32-bit Arm Cortex-M0+ microcontroller Fig 40. Package outline HVQFN32 5x 5x 0.85 mm (SOT617-11) References Outline version European projection Issue date IEC JEDEC JEITA SOT617-11 sot617-11_po 12-09-11 13-01-29 Unit mm max nom min 1.00 0.85 0.80 0.05 0.02 0.00 0.2 5.1 5.0 4.9 3.8 3.7 3.6 5.1 5.0 4.9 0.5 3.5 0.45 0.40 0.35 0.1 A Dimensions (mm are the original dimensions) Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm SOT617-11 A1 b 0.30 0.21 0.18 cD(1) Dh E(1) Eh 3.8 3.7 3.6 ee1 e2 3.5 Lv 0.1 w 0.05 y 0.05 y1 0 5 mm scale terminal 1 index area B A D E MO-220 C y C y1 X detail X A c A1 b e2 e1 e e 1/2 e 1/2 e terminal 1 index area Dh Eh L 1 16 9 25 32 8 24 17 A CB v C w |
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