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DAC8760IPWPR.B Datasheet(PDF) 62 Page - Texas Instruments |
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DAC8760IPWPR.B Datasheet(HTML) 62 Page - Texas Instruments |
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62 / 69 page  www.ti.com PACKAGE OUTLINE C 22X 0.65 2X 7.15 24X 0.30 0.19 6.6 6.2 TYP SEATING PLANE 0.15 0.05 0.25 GAGE PLANE 0 -8 1.2 MAX 2X 2.08 MAX NOTE 5 4X 0.1 MAX NOTE 5 5.26 5.11 3.20 3.05 B 4.5 4.3 A 7.9 7.7 NOTE 3 0.75 0.50 (0.15) TYP 4X 0.3 MAX PowerPAD TSSOP - 1.2 mm max height PWP0024J SMALL OUTLINE PACKAGE 4225860/A 04/2020 1 12 13 24 0.1 C A B PIN 1 INDEX AREA SEE DETAIL A 0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. Reference JEDEC registration MO-153. 5. Features may differ or may not be present. TM PowerPAD is a trademark of Texas Instruments. A 20 DETAIL A TYPICAL SCALE 2.000 THERMAL PAD 1 12 13 24 25 |
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