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0832F–HIREL–02/07
e2v semiconductors SAS 2007
PC7410
Figure 12-3. Cross-section of 360-ball CBGA and HiTCE Package
Figure 12-4. Cross-section of 360-column CI-CGA Package
Substrate Assembly
Encapsulant
View
Die
View
Die
Substrate Assembly
Encapsulant
Table 12-1.
Pinout Listing for the PC7410, 360-ball CBGA and CI-CGA packages
Signal Name
Pin Number
Active
I/O
I/F Select(1)
A[0:31]
A13, D2, H11, C1, B13, F2, C13, E5, D13, G7, F12, G3, G6,
H2, E2, L3, G5, L4, G4, J4, H7, E1, G2, F3, J7, M3, H3, J2,
J6, K3, K2, L2
High
I/O
BVSEL
AACK
N3
Low
Input
BVSEL
ABB(12)
AMON[0](12)
L7
Low
Output
BVSEL
AP[0:3]
C4, C5, C6, C7
High
I/O
BVSEL
ARTRY
L6
Low
I/O
BVSEL
AVDD
A8
VDD
BG
H1
Low
Input
BVSEL
BR
E7
Low
Output
BVSEL
BVSEL(1)(3)(8)(9)(14)
W1
High
Input
N/A
CHK(4)(8)(9)
K11
Low
Input
BVSEL
CI
C2
Low
I/O
BVSEL
CKSTP_IN
B8
Low
Input
BVSEL
CKSTP_OUT
D7
Low
Output
BVSEL
CLK_OUT
E3
High
Output
BVSEL
DBB(12)
DMON[0](12)
K5
Low
Output
BVSEL
DBG
K1
Low
Input
BVSEL
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