MB91F613 datasheet(26/104 Pages) FUJITSU

26 / 104 page

MB91610 Series

DS07-16907-2E

• Baking

Packages that have absorbed moisture may be de-moisturized by baking (heat drying). Follow the FUJITSU

MICROELECTRONICS recommended conditions for baking.

Condition:

+ 125 °C/24 h

• Static Electricity

Because semiconductor devices are particularly susceptible to damage by static electricity, you must take the

following precautions:

(a) Maintain relative humidity in the working environment between 40% and 70%. Use of an apparatus for ion

generation may be needed to remove electricity.

(b) Electrically ground all conveyors, solder vessels, soldering irons and peripheral equipment.

(on the level of 1 M

Ω). Wearing of conductive clothing and shoes, use of conductive floor mats and other

measures to minimize shock loads is recommended.

(d) Ground all fixtures and instruments, or protect with anti-static measures.

(e) Avoid the use of styrofoam or other highly static-prone materials for storage of completed board assemblies.

• Precautions for Use Environment

Reliability of semiconductor devices depends on ambient temperature and other conditions as described above.

For reliable performance, do the following:

(1) Humidity

Prolonged use in high humidity can lead to leakage in devices as well as printed circuit boards. If high humidity

levels are anticipated, consider anti-humidity processing.

(2) Discharge of Static Electricity

When high-voltage charges exist close to semiconductor devices, discharges can cause abnormal operation.

In such cases, use anti-static measures or processing to prevent discharges.

(3) Corrosive Gases, Dust, or Oil

Exposure to corrosive gases or contact with dust or oil may lead to chemical reactions that will adversely

affect the device. If you use devices in such conditions, consider ways to prevent such exposure or to protect

the devices.

(4) Radiation, Including Cosmic Radiation

Most devices are not designed for environments involving exposure to radiation or cosmic radiation. Users

should provide shielding as appropriate.

(5) Smoke, Flame

Note : Plastic molded devices are flammable, and therefore should not be used near combustible substances.

If devices begin to smoke or burn, there is danger of the release of toxic gases.

Customers considering the use of FUJITSU MICROELECTRONICS products in other special environmental

conditions should consult with sales representatives.

MB91F613 Datasheet(PDF) 26 Page - fujitsu semiconductor