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UPD78323LP Datasheet(PDF) 76 Page - NEC |
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UPD78323LP Datasheet(HTML) 76 Page - NEC |
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76 / 86 page  76 µPD78323, 78324 11. RECOMMENDED SOLDERING CONDITIONS The µPD78323 and 78324 should be soldered and mounted under the conditions recommended in the table below. For detail of recommended soldering conditions, refer to the information document Semiconductor Device Mount- ing Technology Manual (IE1-1207). For soldering methods and conditions other than those recommended below, contact our salesman. Table 11-1. Soldering Conditions for Surface Mount Type µPD78323GJ-5BJ : 74-pin plastic QFP (20 × 20 mm) µPD78324GJ-×××-5BJ : 74-pin plastic QFP (20 × 20 mm) Soldering Method Soldering Conditions Package peak temperature: 230 °C, Time: 30 sec. max. (at 210 °C or above) Infrared reflow Number of times: Once, Time limit: 7 daysNote (thereafter 10 hours prebaking required at 125 °C) Package peak temperature: 215 °C, Time: 40 sec. max. (at 200 °C or above) VPS Number of times: Once, Time limit: 7 daysNote (thereafter 10 hours prebaking required at 125 °C) Pin temperature: 300 °C max, Time: 3 sec. max. (Per side of the device) Recommended Condition Symbol Soldering Method Soldering Conditions Package peak temperature: 235 °C, Time: 30 sec. max. (at 210 °C or above) Number of times: twice or less, Time limit: 7 daysNote (thereafter 36 hours prebaking required at 125 ˚C) <Caution> (1) The second reflow should be started after the temperature of the device which would have been changed by the first reflow has returned to normal. (2) Please avoid flux water washing after the first reflow. Package peak temperature: 215 °C, Time: 40 sec. max. (at 200 °C or above), Number of times: twice or less, Time limit: 7 daysNote (thereafter 36 hours prebaking required at 125 ˚C) <Caution> (1) The second reflow should be started after the temperature of the device which would have been changed by the first reflow has returned to normal. (2) Please avoid flux water washing after the first reflow. Pin temperature: 300 °C max., Time: 3 sec. max. (Per side of the device)) Recommended Condition Symbol Infrared reflow IR30-367-2 VP15-367-2 µPD78323LP : 68-pin plastic QFJ ( 950 mil) µPD78324LP-××× : 68-pin plastic QFJ ( 950 mil) Pin part heating IR30-107-1 VP15-107-1 VPS Note For the storage period after dry-pack decompression, storage conditions are max. 25 °C, 65 % RH. Caution Use more than one soldering method should be avoided (except in the case of pin part heating). Pin part heating |
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