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LC823450 Datasheet(PDF) 110 Page - ON Semiconductor |
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LC823450 Datasheet(HTML) 110 Page - ON Semiconductor |
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110 / 112 page ![]() LC823450 www.onsemi.com 110 PACKAGE DIMENSIONS WLCSP154, 5.52x5.33 CASE 567LD ISSUE A SEATING PLANE 0.03 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF THE SOLDER BALLS. 2X DIM A MIN MAX −−− MILLIMETERS A1 D 5.52 BSC E b 0.23 0.29 e 0.40 BSC 0.73 E D A B PIN A1 REFERENCE e A 0.05 B C 0.03 C 0.05 C 154X b 4 5 C B A 0.10 C A A1 C 0.18 0.24 5.33 BSC 0.22 154X DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 0.40 0.40 0.03 C 2X TOP VIEW SIDE VIEW BOTTOM VIEW NOTE 3 e RECOMMENDED PACKAGE OUTLINE 1 2 3 PITCH D E PITCH A1 F 9 10 6 7 8 11 12 e/2 K J H L M N G A3 DETAIL A A DETAIL A A3 0.04 REF 0.20 BACK COAT * The diameter of footprint of the solder ball is as follows. Table 61. Package Code Size of the Footprint XA, XB f 0.20 XC, XD f 0.22 |
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