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LPC5410X Datasheet(PDF) 40 Page - NXP Semiconductors

Part # LPC5410X
Description  32-bit ARM Cortex-M4/M0 MCU; 104 kB SRAM; 512 kB flash, 3 x I2C, 2 x SPI, 4 x USART, 32-bit counter/ timers, SCTimer/PWM, 12-bit 5.0 Msamples/sec ADC
PDF  95 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

LPC5410X Datasheet(HTML) 40 Page - NXP Semiconductors

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LPC5410x
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2019. All rights reserved.
Product data sheet
Rev. 2.11 — 19 September 2019
40 of 95
NXP Semiconductors
LPC5410x
32-bit ARM Cortex-M4/M0+ microcontroller
9. Thermal characteristics
The average chip junction temperature, Tj (C), can be calculated using the following
equation:
(1)
• Tamb = ambient temperature (C),
• Rth(j-a) = the package junction-to-ambient thermal resistance (C/W)
• PD = sum of internal and I/O power dissipation
The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
Table 8.
Thermal resistance
Symbol Parameter
Conditions
Max/Min
Unit
LQFP64 Package
Rth(j-a)
thermal resistance from
junction to ambient
JEDEC (4.5 in
 4 in); still air
58 ± 15 %
C/W
Single-layer (4.5 in
 3 in); still air 81 ± 15 % C/W
Rth(j-c)
thermal resistance from
junction to case
18 ± 15 %
C/W
WLCSP49 Package
Rth(j-a)
thermal resistance from
junction to ambient
JEDEC (4.5 in
 4 in); still air
41 ± 15 %
C/W
Rth(j-c)
thermal resistance from
junction to case
0.3 ± 15 %
C/W
T j
T amb
PD Rth j a
–


+
=



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