STM8L051F3 datasheet(92/96 Pages) STMICROELECTRONICS

Part #	STM8L051F3

Description	8-bit ultra-low-power MCU, 8-Kbyte Flash memory, 256-byte data EEPROM, RTC, timers, USART, I2C, SPI, ADC

PDF	96 Pages

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Manufacturer	STMICROELECTRONICS [STMicroelectronics]

Direct Link	http://www.st.com

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92 / 96 page

Package characteristics

STM8L051F3

92/96

DS9178 Rev 4

9.4

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 15: General operating conditions on page 48.

The maximum chip-junction temperature, TJmax, in degree Celsius, may be calculated using

the following equation:

TJmax = TAmax + (PDmax x ΘJA)

Where:

•

TAmax is the maximum ambient temperature in ° C

•ΘJA is the package junction-to-ambient thermal resistance in ° C/W

•

PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)

•

PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

•

PI/Omax represents the maximum power dissipation on output pins

Where:

PI/Omax = Σ (VOL*IOL) + Σ((VDD-VOH)*I OH),

taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low and high level in

the application.

Table 53. Thermal characteristics(1)

1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection

environment.

Symbol

Parameter

Value

Unit

ΘJA

Thermal resistance junction-ambient

TSSOP20

110

°C/W

STM8L051F3 Datasheet(PDF) 92 Page - STMicroelectronics