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SPC582BX Datasheet(PDF) 60 Page - STMicroelectronics

Part # SPC582BX
Description  SPC58 2B Line - 32 bit Power Architecture automotive MCU Single core 80Mhz, 1MByte Flash, ASIL-B
PDF  115 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

SPC582BX Datasheet(HTML) 60 Page - STMicroelectronics

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Electrical characteristics
SPC582Bx
60/115
DS11597 Rev 4
All the Flash operations require the presence of the system clock for internal
synchronization. About 50 synchronization cycles are needed: this means that the timings of
the previous table can be longer if a low frequency system clock is used.
1. Characteristics are valid both for Data Flash and Code Flash, unless specified in the characteristics column.
2. Actual hardware operation times; this does not include software overhead.
3. Typical program and erase times assume nominal supply values and operation at 25 °C.
4. Typical End of Life program and erase times represent the median performance and assume nominal supply values.
Typical End of Life program and erase values may be used for throughput calculations. These values are characteristic, but
not tested.
5. Lifetime maximum program & erase times apply across the voltages and temperatures and occur after the specified
number of program/erase cycles. These maximum values are characterized but not tested or guaranteed.
6. Initial factory condition: < 100 program/erase cycles, 25 °C typical junction temperature and nominal (± 5%) supply
voltages.
7. Initial maximum “All temp” program and erase times provide guidance for time-out limits used in the factory and apply for
less than or equal to 100 program or erase cycles, –40 °C < TJ < 150 °C junction temperature and nominal (± 5%) supply
voltages.
8. Rate computed based on 128 KB sectors.
9. Only code sectors, not including EEPROM.
10. Time between suspend resume and next suspend. Value stated actually represents Min value specification.
11. Timings guaranteed by design.
12. AIC is done using system clock, thus all timing is dependent on system frequency and number of wait states. Timing in the
table is calculated at max frequency.
Table 33. Flash memory Life Specification
Symbol
Characteristics(1) (2)
1. Program and erase cycles supported across specified temperature specifications.
2. It is recommended that the application enables the core cache memory.
Value
Unit
Min
C
Typ
C
NCER16K 16 KB CODE Flash endurance
10
—
100
— Kcycles
NCER32K 32 KB CODE Flash endurance
10
—
100
— Kcycles
NCER64K 64 KB CODE Flash endurance
10
—
100
— Kcycles
NCER128K 128 KB CODE Flash endurance
1
—
100
— Kcycles
NCER256K
128 KB CODE Flash endurance
1
—
100
— Kcycles
128 KB CODE Flash endurance(3)
3. 10K cycles on 4-128 KB blocks is not intended for production. Reduced reliability and degraded erase time
are possible.
10
—
100
— Kcycles
NDER16K 16 KB DATA EEPROM Flash endurance
250
—
—
— Kcycles
tDR1k
Minimum data retention Blocks with 0 - 1,000 P/E
cycles
25
—
—
—
Years
tDR10k
Minimum data retention Blocks with 1,001 - 10,000
P/E cycles
20
—
—
—
Years
tDR100k
Minimum data retention Blocks with 10,001 - 100,000
P/E cycles
15
—
—
—
Years
tDR250k
Minimum data retention Blocks with 100,001 -
250,000 P/E cycles
10
—
—
—
Years



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