SPC582BX datasheet(102/115 Pages) STMICROELECTRONICS

102 / 115 page

Package information

SPC582Bx

102/115

DS11597 Rev 4

Connect all the ground and power balls to the respective planes with one via per ball. Using

fewer vias to connect the package to the planes reduces the thermal performance. Thinner

planes also reduce the thermal performance. When the clearance between the vias leaves

the planes virtually disconnected, the thermal performance is also greatly reduced.

As a general rule, the value obtained on a single-layer board is within the normal range for

the tightly packed printed circuit board. The value obtained on a board with the internal

planes is usually within the normal range if the application board has:

•

One oz. (35 micron nominal thickness) internal planes

•

Components are well separated

•

Overall power dissipation on the board is less than 0.02 W/cm2

The thermal performance of any component depends on the power dissipation of the

surrounding components. In addition, the ambient temperature varies widely within the

application. For many natural convection and especially closed box applications, the board

temperature at the perimeter (edge) of the package is approximately the same as the local

air temperature near the device. Specifying the local ambient conditions explicitly as the

board temperature provides a more precise description of the local ambient conditions that

determine the temperature of the device.

At a known board temperature, the junction temperature is estimated using the following

equation:

Equation 2

TJ = TB + (RθJB * PD)

where:

TB = board temperature for the package perimeter (°C)

RθJB = junction-to-board thermal resistance (°C/W) per JESD51-8

PD = power dissipation in the package (W)

When the heat loss from the package case to the air does not factor into the calculation, the

junction temperature is predictable if the application board is similar to the thermal test

condition, with the component soldered to a board with internal planes.

The thermal resistance is expressed as the sum of a junction-to-case thermal resistance

plus a case-to-ambient thermal resistance:

Equation 3

RθJA = RθJC + RθCA

where:

RθJA = junction-to-ambient thermal resistance (°C/W)

RθJC = junction-to-case thermal resistance (°C/W)

RθCA = case to ambient thermal resistance (°C/W)

RθJC is device related and is not affected by other factors. The thermal environment can be

controlled to change the case-to-ambient thermal resistance, RθCA. For example, change

the air flow around the device, add a heat sink, change the mounting arrangement on the

printed circuit board, or change the thermal dissipation on the printed circuit board

surrounding the device. This description is most useful for packages with heat sinks where

90% of the heat flow is through the case to heat sink to ambient. For most packages, a

better model is required.

SPC582BX Datasheet(PDF) 102 Page - STMicroelectronics

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