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SPC582BX Datasheet(PDF) 109 Page - STMicroelectronics

Part # SPC582BX
Description  SPC58 2B Line - 32 bit Power Architecture automotive MCU Single core 80Mhz, 1MByte Flash, ASIL-B
PDF  115 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

SPC582BX Datasheet(HTML) 109 Page - STMicroelectronics

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DS11597 Rev 4
109/115
SPC582Bx
Revision history
114
29-Jun-2017
2 (cont’)
Table 29: Standby regulator specifications:
– Updated the min and max values for parameter VSBY.
– For parameter IDDSBY, added “0.984” to typ column.
Table 30: Voltage monitor electrical characteristics:
– Updated the Typ value of parameter VPOR200_C
– Updated the min, typ, and max values of parameter VLVD100_SB,.
– Updated the min and max values for parameter VMVD270_SBY.
– Removed “PowerOn Reset LV”
Updated Section 3.14: Flash
Updated Figure 8: Input equivalent circuit (Fast SARn and SARB channels)
Updated Figure 22: DSPI CMOS master mode — classic timing, CPHA = 1
Table 35: Nexus debug port timing:
– Classification of parameters “tEVTIPW” and “tEVTOPW” changed from “P” to “D”.
Table 38: DSPI CMOS master classic timing (full duplex and output only) —
MTFE = 0, CPHA = 0 or 1:
– Changed the Min value of tSCK (very strong) from 33 to 59.
Added Section 3.15.3: CAN timing
Table 46: eTQFP64 package mechanical data:
– Updated the values.
Table 47: eTQFP100 package mechanical data:
– Updated the values.
Table 48: eTQFP144 package mechanical data:
– Updated the values.
Table 37: DSPI channel frequency support:
– Added column to show slower and faster frequencies..
Table 49: Thermal characteristics for 64 exposed pad eTQFP package:
– Removed parameter
RθJMA.
Table 50: Thermal characteristics for 100 exposed pad eTQFP package:
– Removed parameter
RθJMA.
– Updated the values of all the parameters.
Table 51: Thermal characteristics for 144 exposed pad eTQFP package:
– Removed parameter
RθJMA.
Table 59. Document revision history (continued)
Date
Revision
Changes



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