ST25TB02K datasheet(34/47 Pages) STMICROELECTRONICS

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Maximum ratings

Stressing the device above the ratings listed in the absolute maximum ratings table may cause permanent

damage to the device. These are stress ratings only and operation of the device at these or any other conditions

above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum

ratings conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE

Program and other relevant quality documents.

Table 11. Absolute maximum ratings

Symbol

Parameter

Min. Max.

Unit

TSTG, tSTG Storage conditions

Sawn wafer

(kept in its original packing form)

°C

9 (1)

months

Unsawn wafer

(kept in its antistatic bag)

°C

months

ICC

Supply current on AC0 / AC1

VMAX (2)

RF input voltage amplitude between AC0 and AC1, GND

pad left floating

VESD

Electrostatic discharge voltage

Human Body Model (3)

2000 V

1. Counted from ST shipment date.

2. Based on characterization, not tested in production.

3. Positive and negative pulses applied on different combinations of pin connections, according to AEC-Q100-002 (compliant

with ANSI/ESDA/JEDEC JS-001-2012, C1=100 pF, R1=1500 Ω, R2=500 Ω).

ST25TB02K

Maximum ratings

DS11469 - Rev 7

page 34/47

ST25TB02K Datasheet(PDF) 34 Page - STMicroelectronics