DA9062 datasheet(12/101 Pages) RENESAS

12 / 101 page

DA9062

PMIC for Applications Requiring up to 8.5 A

Datasheet

Revision 3.8

15-Feb-2022

CFR0011-120-00

12 of 99

4.1

Thermal Characteristics

Table 6: QFN Package Ratings

Parameter

Symbol

Note

Typ

Unit

Thermal resistance junction to ambient

R_JA

Note 1

20.81

°C/W

Thermal resistance junction to Board

R_JB

Note 1

5.9

°C/W

Thermal resistance junction to case

R_JC

Note 1

18.72

°C/W

Maximum power dissipation

Note 1

PDISS

Derating factor above TA =

70 °C: 48.05 mW/°C

3120

Note 1

Obtained from package thermal simulation, 76 mm x 114 mm x 1.6 mm (JEDEC), 6-layer board,

μm thick copper top/bottom layers, 35 μm thick copper inside layers, 49 x 0.2 mm thermal vias

beneath the device, natural convection (still air).

4.1.1

Power Derating Curves

Figure 3: QFN40 Power Derating Curve

Table 7: Typical Temperatures

TA = 70 °C

TA = 85 °C

TA = 105 °C

TWARN

PD=3.12 W

PD=1.92 W

PD=0.96 W

TCRIT

PD=2.64 W

PD=2.40 W

PD=1.44 W

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