UPD75P4308GS datasheet(3/61 Pages) RENESAS

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DATA SHEET

MOS INTEGRATED CIRCUIT

µPD75P4308

The

µPD75P4308 replaces the µPD754304’s internal mask ROM with a one-time PROM and features expanded

ROM capacity.

Because the

µPD75P4308 supports programming by users, it is suitable for use in prototype testing for system

development using the

µPD754302 and 754304 products, and for use in small-lot production.

Detailed descriptions of functions are provided in the following document. Be sure to read the document

before designing.

µPD754304 User’s Manual: U10123E

FEATURES

•

Compatible with

µPD754304

•

Memory capacity:

· PROM : 8192

× 8 bits

· RAM

: 256

× 4 bits

•

Can operate in the same power supply voltage as the mask version

µPD754304

·VDD = 1.8 to 5.5 V

•

Adopts a compact shrink SOP package

ORDERING INFORMATION

Part Number

Package

µPD75P4308GS

36-pin plastic shrink SOP (300 mil, 0.8 mm pitch)

µPD75P4308GS-A

36-pin plastic shrink SOP (300 mil, 0.8 mm pitch)

Caution

On-chip pull-up resistors by mask option are not provided.

Remark

Products with “-A” at the end of the part number are lead-free products.

4-BIT SINGLE-CHIP MICROCONTROLLER

Document No. U10909EJ2V1DS00 (2nd edition)

Date Published August 2005 N CP (K)

Printed in Japan

The mark

shows major revised points.

The information in this document is subject to change without notice. Before using this document, please

confirm that this is the latest version.

Not all products and/or types are available in every country. Please check with an NEC Electronics

sales representative for availability and additional information.

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