µPD75P4308

3

Data Sheet U10909EJ2V1DS

CONTENTS

1.

PIN CONFIGURATION (Top View) ..................................................................................................... 4

2.

BLOCK DIAGRAM ............................................................................................................................... 5

3.

PIN FUNCTIONS .................................................................................................................................. 6

3.1

Port Pins ........................................................................................................................................................ 6

3.2

Non-port Pins ................................................................................................................................................ 8

3.3

Pin I/O Circuits .............................................................................................................................................. 9

3.4

Recommended Connection of Unused Pins ............................................................................................ 11

4.

SWITCHING FUNCTION BETWEEN Mk I MODE AND Mk II MODE ......................................... 12

4.1

Differences between Mk I Mode and Mk II Mode ..................................................................................... 12

4.2

Setting of Stack Bank Selection (SBS) Register ..................................................................................... 13

5.

DIFFERENCES BETWEEN

µPD75P4308 AND µPD754302, 754304 ..........................................14

6.

MEMORY CONFIGURATION ............................................................................................................ 15

7.

INSTRUCTION SET ........................................................................................................................... 17

8.

ONE-TIME PROM (PROGRAM MEMORY) WRITE AND VERIFY ............................................... 28

8.1

Operation Modes for Program Memory Write/Verify ............................................................................... 28

8.2

Program Memory Write Procedure ........................................................................................................... 29

8.3

Program Memory Read Procedure ........................................................................................................... 30

8.4

One-Time PROM Screening ....................................................................................................................... 31

9.

ELECTRICAL SPECIFICATIONS ...................................................................................................... 32

10. CHARACTERISTIC CURVES (FOR REFERENCE ONLY) ............................................................ 45

11.PACKAGE DRAWINGS ..................................................................................................................... 47

12. RECOMMENDED SOLDERING CONDITIONS ................................................................................ 48

APPENDIX A. COMPARISON OF

µPD750004, 754304, AND 75P4308 FUNCTIONS......................49

APPENDIX B. DEVELOPMENT TOOLS ................................................................................................ 51

APPENDIX C. RELATED DOCUMENTS ................................................................................................ 55