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UPD75P4308GS Datasheet(PDF) 16 Page - Renesas Technology Corp

Part # UPD75P4308GS
Description  MOS INTEGRATED CIRCUIT
PDF  61 Pages
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

UPD75P4308GS Datasheet(HTML) 16 Page - Renesas Technology Corp

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µPD75P4308
14
Data Sheet U10909EJ2V1DS
5. DIFFERENCES BETWEEN
µPD75P4308 AND µPD754302, 754304
The
µPD75P4308 replaces the internal mask ROM in the µPD754302 and 754304 with a one-time PROM and
features expanded ROM capacity. The
µPD75P4308’s Mk I mode supports the Mk I mode in the µPD754302 and
754304 and the
µPD75P4308’s Mk II mode supports the Mk II mode in the µPD754302 and 754304.
Table 5-1 lists differences among the
µPD75P4308 and the µPD754302 and 754304. Be sure to check the
differences between corresponding versions beforehand, especially when a PROM version is used for debugging or
prototype testing of application systems and later the corresponding mask ROM version is used for full-scale
production.
For details of CPU functions and incorporated hardware, refer to
µPD754304 User’s Manual (U10123E).
Table 5-1. Differences between
µPD75P4308 and µPD754302, 754304
Item
µPD754302
µPD754304
µPD75P4308
Program counter
11-bit
12-bit
13-bit
Program memory (bytes)
Mask ROM
Mask ROM
One-time PROM
2048
4096
8192
Data memory (
× 4 bits)
256
Mask options
Pull-up resistor for
Yes (On-chip/not on-chip specifiable)
No (On-chip not possible)
PORT5
Wait time in
Yes (Selectable from 217/fX and 215/fX)Note
No (fixed at 215/fX)Note
RESET state
Pin configuration
Pins 5 to 8
P33-P30
P33/MD3-P30/MD0
Pin 19
IC
VPP
Pins 29 to 32
P63/KR3-P60/KR0
P63/KR3/D3-
P60/KR0/D0
Pins 33 to 36
P53-P50
P53/D7-P50/D4
Other
Noise resistance and noise radiation may differ due to the different circuit
complexities and mask layouts.
Note 217/fX: 21.8 ms @6.0-MHz operation, 31.3 ms @4.19-MHz operation.
215/fX: 5.46 ms @6.0-MHz operation, 7.81 ms @4.19-MHz operation.
Caution Noise resistance and noise radiation are different in PROM version and mask ROM versions. If
using a mask ROM version instead of the PROM version for processes between prototype
development and full production, be sure to fully evaluate the CS (not ES) of the mask ROM
version.



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