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TLV2548MFKB Datasheet(PDF) 19 Page - Texas Instruments

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Part # TLV2548MFKB
Description  3-V TO 5.5-V, 12-BIT, 200-KSPS, 4-/8-CHANNEL, LOW-POWER SERIAL ANALOG-TO-DIGITAL CONVERTERS WITH AUTOPOWER-DOWN
PDF  41 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TLV2548MFKB Datasheet(HTML) 19 Page - Texas Instruments

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TLV2544Q, TLV2548Q, TLV2548M
3-V TO 5.5-V, 12-BIT, 200-KSPS, 4-/8-CHANNEL, LOW-POWER
SERIAL ANALOG-TO-DIGITAL CONVERTERS WITH AUTOPOWER-DOWN
SGLS119C – FEBRUARY 2002 – REVISED OCTOBER 2002
19
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
reference block equivalent circuit
INT REF
Close = Int Ref Used
Open = Ext Ref Used
REFM
Sample
Convert
~50 pF
CDAC
External to the Device
10
µF
Internal
Reference
Compensation
Cap
0.1
µF
Decoupling
Cap
REFP
NOTES: A. If internal reference is used, tie REFM to AGND and install a 10
µF (or 4.7 µF) internal reference compensation capacitor between
REFP and REFM to store the charge as shown in the figure above.
B. If external reference is used, the 10
µF (internal reference compensation) capacitor is optional. REFM can be connected to external
REFM or AGND.
C. Internal reference voltage drift, due to temperature variations, is approximately
±10 mV about the nominal 2 V (typically) from –10°C
to 100
°C . The nominal value also varies approximately ±50 mV across devices.
D. Internal reference leakage during low ON time: Leakage resistance is on the order of 100 M
Ω or more. This means the time constant
is about 1000 s with 10
µF compensation capacitance. Since the REF voltage does not vary much, the reference will come up quickly
after resuming from auto power down. At power up and power down the internal reference sees a glitch of about 500
µV when 2
V internal reference is used (1 mV when 4 V internal reference is used). This glitch settles out after about 50
µs.
power down
Writing 8000h to the device puts the device into a software power down state. For a hardware power-down, the
dedicated PWDN pin provides another way to power down the device asynchronously. These two power-down
modes power down the entire device including the built-in reference to save power. It requires 20 ms to resume
from either a software or hardware power down.
Auto power-down mode is always enabled. This mode maintains the built-in reference if an internal reference
is used so resumption is fast enough to be used between cycles.
The configuration register is not affected by any of the power down modes but the sweep operation sequence
has to be started over again. All FIFO contents are cleared by the power-down modes.



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