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S29GL01GS10DFIV13 Datasheet(PDF) 94 Page - Cypress Semiconductor

Part # S29GL01GS10DFIV13
Description  1-Gbit (128 Mbyte)/512-Mbit (64 Mbyte)/256-Mbit (32 Mbyte)/128-Mbit (16 Mbyte),3.0 V, GL-S Flash Memory
PDF  108 Pages
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

S29GL01GS10DFIV13 Datasheet(HTML) 94 Page - Cypress Semiconductor

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Document Number: 001-98285 Rev. *R
Page 94 of 108
S29GL01GS/S29GL512S
S29GL256S/S29GL128S
12.2.3
Physical Diagram – LAA064
3354 \ 16-038.12d
PACKAGE
LAA 064
JEDEC
N/A
13.00 mm x 11.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
---
1.40
PROFILE HEIGHT
A1
0.40
---
---
STANDOFF
A2
0.60
---
---
BODY THICKNESS
D
13.00 BSC.
BODY SIZE
E
11.00 BSC.
BODY SIZE
D1
7.00 BSC.
MATRIX FOOTPRINT
E1
7.00 BSC.
MATRIX FOOTPRINT
MD
8
MATRIX SIZE D DIRECTION
ME
8
MATRIX SIZE E DIRECTION
N
64
BALL COUNT
φb
0.50
0.60
0.70
BALL DIAMETER
eD
1.00 BSC.
BALL PITCH - D DIRECTION
eE
1.00 BSC.
BALL PITCH - E DIRECTION
SD / SE
0.50 BSC.
SOLDER BALL PLACEMENT
NONE
DEPOPULATED SOLDER BALLS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.



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