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S29GL01GS10DFIV13 Datasheet(PDF) 96 Page - Cypress Semiconductor

Part # S29GL01GS10DFIV13
Description  1-Gbit (128 Mbyte)/512-Mbit (64 Mbyte)/256-Mbit (32 Mbyte)/128-Mbit (16 Mbyte),3.0 V, GL-S Flash Memory
PDF  108 Pages
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

S29GL01GS10DFIV13 Datasheet(HTML) 96 Page - Cypress Semiconductor

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Document Number: 001-98285 Rev. *R
Page 96 of 108
S29GL01GS/S29GL512S
S29GL256S/S29GL128S
12.3.2
Physical Diagram - VBU 056
13. Special Handling Instructions for FBGA Package
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data
integrity may be compromised if the package body is exposed to temperatures above 150 °C for prolonged periods of time.
SEATING PLANE
E1
7
SE
D1
e
A
C
DB
E
F
G
H
7
8
6
5
3
2
1
e
4
A1 CORNER
7
SD
BOTTOM VIEW
C
C
A
D
E
C
0.10
(2X)
C
0.10
B
(2X)
C
9
SIDE VIEW
TOP VIEW
INDEX MARK
A1
A
A1 CORNER
0.10
0.08
B
A
C
M
M C
0.08
0.15
6
56 b
g1055\ 16-038.25 \ 01.26.12
NOTES:
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JEP95, SECTION
4.3, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF POPULATED SOLDER
BALL POSITIONS FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. "+" INDICATES THE THEORETICAL CENTER OF
DEPOPULATED BALLS.
9
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
10. OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.
PACKAGE
VBU 056
JEDEC
N/A
9.00 mm x 7.00 mm NOM
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
---
1.00
OVERALL THICKNESS
A1
0.17
---
---
BALL HEIGHT
D
9.00 BSC.
BODY SIZE
E
7.00 BSC.
BODY SIZE
D1
5.60 BSC.
BALL FOOTPRINT
E1
5.60 BSC.
BALL FOOTPRINT
MD
8
ROW MATRIX SIZE D DIRECTION
ME
8
ROW MATRIX SIZE E DIRECTION
N
56
TOTAL BALL COUNT
b
0.35
0.40
0.45
BALL DIAMETER
e
0.80 BSC.
BALL PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
A1,A8,D4,D5,E4,E5,H1,H8
DEPOPULATED SOLDER BALLS



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